M-BOND™ 610 Adhesive

This non-conductive, high-performance adhesive is a solvent-thinned, epoxy-phenolic formulation designed for demanding applications. Its chemical resistance and thin application layer make it ideal for ion milling, cross-sectioning, and various electron microscopy preparations. With low viscosity, the adhesive forms an ultra-thin layer that minimizes issues like creep, hysteresis, and linearity problems. The solids content is 22%, offering excellent bonding properties for securely mounting samples on TEM grids and ensuring reliable adhesion during TEM dimpling or FIB imaging.

The adhesive’s operating temperature range spans from -269°C to +370°C for short-term use and -269°C to +260°C for long-term stability, accommodating a remarkable 3% elongation at 24°C. This broad thermal tolerance makes it one of the most versatile general-purpose adhesives on the market.

Each kit includes:

Four 14g resin bottles
Four 11g curing agent bottles
Four brush caps for easy application
Four disposable mixing funnels
Detailed instructions

M-Bond™ 610 Use Instructions

Surface Preparation

For best adhesion, ensure metal surfaces are thoroughly cleaned. Typically, rigorous solvent degreasing is effective; SPI Carbon Paint Thinner is recommended for effective surface cleaning, as long as the surface is compatible with organic solvents. Surfaces should be smooth and free from pits or irregularities. Clean a slightly larger area than the intended application of M-Bond 610 (and the gage if applicable).

Handling Precautions

M-Bond 610 contains epoxy resins and epoxy-phenolic resins, which may cause skin sensitivity, dermatitis, or allergic reactions. To minimize risk:

Avoid direct contact with the curing agent or adhesive.
Prevent inhalation of vapors.
Always work in a well-ventilated area. If skin contact occurs, wash the area with soap and water immediately. In case of eye contact, flush thoroughly and seek medical attention. Use protective rubber gloves, aprons, and avoid contaminating work surfaces, tools, and container handles. Clean up spills promptly.

Mixing Instructions

M-Bond 610 is a two-component adhesive system. Follow these steps for proper mixing:

Ensure both resin and curing agent bottles are at room temperature before opening.
Use a disposable plastic funnel to transfer the curing agent into the adhesive bottle, then discard the funnel.
Tighten the applicator cap and shake the adhesive bottle vigorously for at least 10 seconds.
Mark the bottle with the mixing date and allow the adhesive to stand for one hour before use.

Shelf Life and Pot Life

Shelf Life: Stored at room temperature (24°C or 75°F), M-Bond 610 has a shelf life of about 9 months from the manufacturing date. Refrigeration at 5°C (40°F) can extend shelf life up to approximately 15 months.
Pot Life: Once opened and mixed, the adhesive’s pot life at room temperature is six weeks. Refrigeration at 5°C (40°F) can extend this up to 12 weeks. Never open a refrigerated bottle until it reaches room temperature.

Elongation Capabilities and Temperature Limits

M-Bond 610 remains effective for temperatures from deep cryogenic (-269°C or -452°F) up to 370°C (700°F) for short durations and -269°C (-452°F) to 260°C (500°F) for prolonged periods. For transducer applications, limit use to a maximum of 230°C (450°F). Elongation capacities are approximately:

1% at -269°C (-452°F)
3% from room temperature up to 260°C (500°F)

These guidelines ensure optimal performance and longevity of M-Bond™ 610 under various conditions.

M-BOND™ 610 Adhesive

Reviews